The history of Nippon Scientific Co.,Ltd.
  About Company & Enterprise About Product and Technology
1987 Foundation of Nippon Scientific Co., Ltd. Release Fuming Nitric acid type [Plastic Mold Opener PA101*]
1989 Release Vacuum Oven [Thermo back VT Series](VT210*, 220*, 230*, 240*)
1990 Release Dry Etching System for IC [RIE System ES301]
Release Fuming Nitric and Auto mixing acid type [Plastic Mold Opener PA102*]
1991 Establish Singapore office Release Fuming Nitric and Mixing acid type [Plastic Mold Opener PA103*]
1993 Release Dry Etching System for Wafer [RIE System ES401*]
Release Dry Etching System for Fine Process LSI [RIE System ES371*]
1994 Organize ED Lab and start contract decapsulation service
1995 Release Automatic I/O Testing System [FB101*]
1997 Release Temperature Controller for Liquid Crystal [FC101*]
Approved Subsidization of New Technology Development for [LC Viewer FC201] By Tokyo Metropolitan Small and Medium Enterprise Support Center
1998 Release [LC Viewer FC201*]
Release Auto Mixing Fuming Nitric and Fuming Sulfuric Acid type [Plastic Mold Opener PS101*]
1999 Release Dynamic Burn-In System [BR101]
Release Failure Analytical Tester [FA201]
2000 Approved as 1st candidate for New Business Investment by Governmental Venture Capital Release Dynamic Burn-In System [BR201*]
Release Fast Automatic I/O Testing System [FB102]
2001 Release Dynamic Burn-In System [BR301*]
2003 Release Curve Tracer [FB200]
2004 Release Dry Decapsulation System [Dry Decapper ES312]
Release Micro Router for Preparation on IC Decapsulation [Micro Router PE101*]
2006 Release Sophisticated IC Backside Preparation System [Micro Shiner BA101]
Release Fuming Nitric and Fuming Sulfuric Acid type [Plastic Mold Opener PS102S*]
Release Fuming Nitric and Sulfuric Auto mixing Acid type [Plastic Mold Opener PS102W*]
2007 Winning first prize [Plastic Mold Opener] by Itabashi Product Technology Prize
2008 Release Dry Etching System for Fine Process LSI [RIE System ES372*]
2009 Release IC Laser Decapsulation System [Laser Opener PL101]
2010 Release IC Laser Decapsulation System [Laser Opener PL121]
Release Fuming Nitric and Sulfuric Acid type [Plastic Mold Opener PS103S]
2012 Headquarter shift to Shingashi, Itabashi-ku Subsidiary Acquisition of Singapore Office
2013 Release Dry Etching System for Fine Process LSI [RIE System ES373]
Release Fuming Nitric and Sulfuric Auto mixing Acid type [Plastic Mold Opener PS105]
Release IC Laser Decapsulation System [Laser Opener PL I series]
2015 Release Dry Etching System for Wafer [RIE System ES403]
*Discontinued