Product List
IC Decapsulation System
Acid Decapsulation
As a leading IC decapsulation system provider, NSC manufactures effective systems to meet various IC’s opening requirements.
Laser Decapsulation System
Plasma Decapsulation
Mechanical Decapsulation (Cross sectioning, Milling, and Grinding)
Dry Etching System
Dry Etching System is used for the removal of polyimide and passivation such as SiN and SiO2. Effective for lower patterned layers analysis.
Failure Analysis Testing System
Personal type FB200 2nd and High-Speed automatic testing system FB102-0 are available. Effective for high-pin counts I/O check and analysis under static conditions.
