Laser Decapsulation System
Outline / Feature
PL101 / PL101_10 --- Select any location for Installation
No chemical is used in this system, so User can install this machine at any location. It can be installed even on a normal desk due to the compact design. Thus, user can save the operation cost.
PL121 --- Used for the bigger samples
For sample of various types and sizes, it is most convenient with the bigger stage and the setting space.
Pre-decapsulation of package by Laser Opener reduces subsequent Chemical decap time and consumption.
Pre-decapsulation of package by Laser Opener makes time shorter for Dry Decapsulation. As a result, it can create the best decap result for IC.
For Cu Wire IC Decapsulation
Laser Opener can decap Secondary resist area without using Acid.
For Secondary-Bond (Stitch) Decapsulation
Laser Opener can decap Secondary resist area without using Acid.
Pre-decapsulation for the Backside observation
It can be used to remove the Backside Die frame within a short time
For observation on Wire surface condition
It is effective for the observation on Wire Surface and Secondary side Bonding area.
Option
PC for system control
Cleaner with HEPA filter
Ionizer
Trestle(table)
Particle Collector --- Power Supply is integrated with Laser start/end process.
Process Pattern (Examples)
For Bigger Sample or Thicker IC (PL101_01 PL121)
This model type is effective for Power Module and IGBT used on Hybrid Car, Electric Car, Photovoltaic Generation and so on.
Selectable Process Pattern
Combination of High Power and Low Power process and Cross-sectioning Process can be selected for various kind of purposes.
User Friendly Operation
Just select from the recommended several recipe and set for all procedure.
Compact Design
All model types are very Compact and User Friendly Design.